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DISCRETE SEMICONDUCTORS
DATA SHEET
PEMB2; PUMB2 PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
Product data sheet Supersedes data of 2001 Sep 14 2003 Oct 15
NXP Semiconductors
Product data sheet
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
FEATURES * Built-in bias resistors * Simplified circuit design * Reduction of component count * Reduced pick and place costs. APPLICATIONS * Low current peripheral drivers * Replacement of general purpose transistors in digital applications * Control of IC inputs. DESCRIPTION PNP/PNP resistor-equipped transistors (see "Simplified outline, symbol and pinning" for package details). PRODUCT OVERVIEW PACKAGE TYPE NUMBER PHILIPS PEMB2 PUMB2 Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. SIMPLIFIED OUTLINE, SYMBOL AND PINNING SOT666 SOT363 EIAJ - SC-88 B2 B*2(1) MARKING CODE QUICK REFERENCE DATA SYMBOL VCEO IO TR1 TR2 R1 R2
PEMB2; PUMB2
PARAMETER collector-emitter voltage output current (DC) PNP PNP bias resistor bias resistor
TYP. - - - - 47 47
MAX. -50 -100 - - - -
UNIT V mA - - k k
NPN/PNP COMPLEMENT PEMD12 PUMD12
NPN/NPN COMPLEMENT PEMH2 PUMH2
PINNING TYPE NUMBER PEMB2 PUMB2
6 5 4
SIMPLIFIED OUTLINE AND SYMBOL PIN
6 5 4
DESCRIPTION emitter TR1 base TR1 collector TR2 emitter TR2 base TR2 collector TR1
1 2 3
R1 TR1 R2
R2 TR2 R1
4 5 6
1
Top view
2
3
1
MAM477
2
3
2003 Oct 15
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NXP Semiconductors
Product data sheet
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PEMB2 PUMB2 - - DESCRIPTION plastic surface mounted package; 6 leads plastic surface mounted package; 6 leads
PEMB2; PUMB2
VERSION SOT666 SOT363
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per transistor VCBO VCEO VEBO VI collector-base voltage collector-emitter voltage emitter-base voltage input voltage positive negative IO ICM Ptot output current (DC) peak collector current total power dissipation SOT363 SOT666 Tstg Tj Tamb Per device Ptot total power dissipation SOT363 SOT666 Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. Tamb 25 C note 1 notes 1 and 2 - - 300 300 mW mW storage temperature junction temperature operating ambient temperature Tamb 25 C note 1 notes 1 and 2 - - -65 - -65 200 200 +150 150 +150 mW mW C C C - - - - +10 -40 -100 -100 V V mA mA open emitter open base open collector - - - -50 -50 -5 V V V PARAMETER CONDITIONS MIN. MAX. UNIT
2003 Oct 15
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NXP Semiconductors
Product data sheet
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
THERMAL CHARACTERISTICS SYMBOL Per transistor Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Per device Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Notes Tamb 25 C note 1 note 1 Tamb 25 C note 1 notes 1 and 2 PARAMETER CONDITIONS
PEMB2; PUMB2
VALUE
UNIT
625 625
K/W K/W
416 416
K/W K/W
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL ICBO ICEO IEBO hFE VCEsat Vi(off) Vi(on) R1 R2 ------R1 Cc PARAMETER collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain saturation voltage input-off voltage input-on voltage input resistor resistor ratio collector capacitance IE = ie = 0; VCB = -10 V; f = 1 MHz CONDITIONS VCB = -50 V; IE = 0 VCE = -30 V; IB = 0 VCE = -30 V; IB = 0; Tj = 150 C VEB = -5 V; IC = 0 VCE = -5 V; IC = -5 mA IC = -10 mA; IB = -0.5 mA VCE = -5 V; IC = -100 A VCE = -0.3 V; IC = -2 mA MIN. - - - - 80 - - -3 33 0.8 - TYP. - - - - - - -1.2 -1.6 47 1 - MAX. -100 -1 -50 -90 - -150 -0.8 - 61 1.2 3 pF mV V V k UNIT nA A A A
2003 Oct 15
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NXP Semiconductors
Product data sheet
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
PACKAGE OUTLINES
PEMB2; PUMB2
Plastic surface mounted package; 6 leads
SOT666
D
A
E
X
S
YS HE
6
5
4
pin 1 index A
1
e1 e
2
bp
3
wMA Lp detail X
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1
OUTLINE VERSION SOT666
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 01-01-04 01-08-27
2003 Oct 15
5
NXP Semiconductors
Product data sheet
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
PEMB2; PUMB2
Plastic surface mounted package; 6 leads
SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC EIAJ SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
2003 Oct 15
6
NXP Semiconductors
Product data sheet
PNP/PNP resistor-equipped transistors; R1 = 47 k, R2 = 47 k
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes PRODUCT STATUS(2) Development Qualification Production DEFINITION
PEMB2; PUMB2
This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
2003 Oct 15
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NXP Semiconductors
Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers.
Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com
(c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R75/02/pp8 Date of release: 2003 Oct 15 Document order number: 9397 750 11791

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